“We tested aluminum initially, but eventually settled on a thick copper heatsink to transfer heat more efficiently,” Kolari says. “This design draws heat out of the processor and brings it around the motherboard and out to the rear case where it transfers heat through a high-efficiency thermal pad. This design is fully internal to the camera and maintains the weather sealing of the camera.”
In the video test above, Kolari shows that its modification has a notable effect on performance. The team tested the camera by shooting in 8K-D IPB 30FPS at two ambient temperatures: 59 degrees Fahrenheit (15 degrees Celcius) and 69 degrees Fahrenheit (20 degrees Celcius).